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Wafer Size Φ 450 mm. Best Seller Machine W-GM-Series. Improve the Space Efficiency by the Compact Design. Highly Accurate Grinding by the Synchronized X, Y, θ Support Control. Easy Operation by Touch Panel. Automatic feed-back of processing result will be given.
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Mission and Vision Overview Unbalanced rotating equipment causes vibration, loss of accuracy, excessive mechanical wear and increased running costs. To overcome these problems, Accretech SBS provides advanced dynamic balancing solutions – enabling customers to optimize their grinding processes and equipment for maximum precision, productivity. cost-effectiveness and safety. Our …
Individual grinding wheels or grinding wheel assemblies can be balanced fully automatically, under operational conditions, with high reliability & accuracy. Our SB-5500 control is now a part of the Hydrokompenser system, allowing greater speed, accuracy and ease of use. Communication with the machine control is via profibus or hardwire interface.
Semiconductor Manufacturing Equipment. ACCRETECH next generation systems support customers' optimum device productions. Dicing Machines. Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH …
High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials. High Rigid Grinder: HRG3000RMX. Fully Automatic High Rigid Triple Axis Grinder. Catalog PDF (619.5KB) High Rigid Grinder: HRG300/HRG300A. HRG300 allows the processing of individual ...
The AE-1000 from SBS is designed to safeguard grinding machines from damaging crashes between the grinding wheel and machine components. It provides efficient and timely gap and crash control, thus ensuring smooth, glitch-free running of the grinding machine.
The SB-5500 series is a newly enhanced balancer control platform from SBS. The unit is applicable for all grinding equipment. The SB-5500 family includes options for a large resolution display, digital electronic framework, multiple communication choices, four …
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Polish Grinders. Polish grinders simultaneously thin wafers while performing damage removal caused by the grinding process, and offer various applications for peripheral processes in the one system. Polish Grinder: PG3000RMX. Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in massproducing.
This is a for sale ad about ACCRETECH / TSK PG300RM Polishing & Grinding. Its condition is used, second hand, surplus, or refurbished. EquipMatching Ad 426167
Grinder – High Rigid Grinder. The High Rigid Grinder is particularly suitable for companies who use very hard materials such as SiC, Sapphire, Si, ALN or GaN for wafer production. With the HRG300/HRG300A, individual wafers with large diameters (300 mm or 450 mm) can be ground as well as whole wafer stacks with smaller diameters.
ACCRETECH EUROPE – Industrielle Messtechnik und Semiconductor-Equipment. ACCRETECH, die Marke von Tokyo Seimitsu, wurde 1949 in Tokyo gegründet und ist heute weltweit einer der führenden Anbieter von industrieller Messtechnik und modernstem Equipment für die Halbleiterindustrie mit weltweit mehr als 3.000 Beschäftigten.
Our Story Accretech SBS designs, manufactures and markets the SBS system: a simple and reliable solution for in-process dynamic balancing of precision grinding machines. Precision grinding is a necessary step for nearly every manufacturing process. The Company's SBS dynamic balancing systems can detect and dynamically correct vibration as low as 0.02 microns to ensure product quality. […]
Find out all of the information about the Accretech SBS, Inc product: dynamic balancing system SB-1000: Balance control for grinding machines. Contact a supplier or the parent company directly to get a quote or to find out a price or your closest point of sale.
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Acretech Grinding Machine Specializing in the production of jaw crusher, sand machine, ball mill, Raymond mill, cement equipment and other products. The main products are E-crusher, impact crusher, hammer crusher, impact crusher, Raymond mill, magnetic separator and other equipment, you can tailor-made production line, welcome to buy
Wafer Edge Grinding Machine. Highly accurate wafer edge grinding Machine for φ50 mm to 200 mm, 300 mm, and 450 mm wafer production. It is used in production lines of all over the world. W-GM-4200. Capable of Grinding Various Material & Wafer Size. Catalog PDF (210.9KB)
As a professional recycling machine maker, ACERETECH continues to cultivate technology and manufacturing capabilities. Now we have successfully developed a series of plastic recycling, washing, and re-pelletizing lines. Contact us for more detail.
ACCRETECH, the brand from Tokyo Seimitsu, was founded in 1949 in Tokyo and today is one of the leading providers of industrial measuring technology and the latest equipment for the semiconductor industry with more than 3,000 employees worldwide. ACCRETECH (Europe) has been firmly entrenched in the European market since 1989.
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SBS acoustic emission sensors help grinding machine operators maximize the efficiency of the grinding process, thereby increasing part throughput and lowering operating costs. Originally a division of Schmitt Industries, Accretech SBS was acquired by Accretech in 2019.
Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness. The non-contact measuring method achieves the stable alignment. Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.
. 、。.,。.,,。. HRG300 （300 mm）, ...
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Details. SC-3011. Accretech/TSK APM90 Prober. Details. 75934. Accretech/TSK A-W-200T Dicing Saw. Details. 49269. Accretech/TSK AWD-300TXB Back Grinder/Dicing Saw.
Pfaff Grinding Aid. Aug 30 2017nbsp018332Pfaff sewing machines are designed to sew smooth even seams If your machine is sewing uneven seams with skipped stitches or knots of thread underneath troubleshoot your machine to fix the problem First you will thoroughly clean and oil your machine then you will fine tune the tension
Dicing Machine : AD3000T-PLUS. 12-inchi Fully Automatic Dicing Machine. Tokyo Seimitsu Dicing Machine realizes the remarkable "CoO (Cost of Ownership)" by the world smallest footprint, high throughput, and high processing quality reinforced by the …
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